RIE2: III-V Reactive Ion Etcher

Model: Trion Technology Minilock II
Location: 1505 Fitzpatrick CIEMAS
Tool Group and Rate: Clean Room - $36.1/$72.2 per hour

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The Trion Minilock II reactive ion etcher (RIE) is designed for either isotropic or anisotropic dry etching of compound III-V semiconductors and metals using chlorine and bromine based chemistries (BCl3, Cl2, HBr, SiCl4, CH4, H2, CF4, O2, Ar). It has a compact modular design on a space-saving rollaway platform. Included in the system is an integrated vacuum loadlock to meet all of the safety and equipment needs for the more challenging etch processes that require corrosive chemistries. Also, it can handle processing of multiple sized substrates or pieces up to 8 inches in diameter. A 600 watt 13.56MHz inductively coupled plasma (ICP) generator and a helical groove pump allow for a large process window for many applications. A touchscreen interface with Windows/PC software for the process controller allows easy monitoring of process parameters at all times.

Applications	Reactive Ion Etching (RIE) of compound III-V semiconductors using chlorine and bromine based chemistries
Features	Available gases: BCl3, Cl2, HBr, SiCl4, CH4, H2, CF4, O2, Ar 600 watt 13.56MHz inductively coupled plasma (ICP) generator Separate vacuum loadlock with robot arm for sample transfer Ability to process substrates from small pieces up to 8 inch diameter wafers Touchscreen interface with Windows software on a PC process controller Independent pressure control Recirculating temperature controlled heater/chiller Helical groove pump 50 cfm corrosive series dry rough pump
Specifications