RTA1: Rapid Thermal Anneal System

Model: Jipelec JetFirst 100
Location: 1505 Fitzpatrick CIEMAS
Tool Group and Rate: Clean Room - $36.1/$72.2 per hour

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The Jipelec JetFirst rapid thermal annealing (RTA) system is a bench top system designed for R&D applications.  The temperature measurement and control system provides accurate and repeatable thermal control across the temperature range.  Annealing can be performed in air, vacuum, N2, or forming gas (N2/H2).

The system is configured to process substrates up to 100mm in diameter.  Smaller substrates and pieces can easily be processed using the silicon carbide coated graphite susceptor or by placing them a silicon wafer.

Applications	Annealing of silicon and III-V semiconductor substrates Contact alloying
Features	Cold wall chamber technology Thermocouple temperature control Atmospheric and vacuum process capability Two process gas lines with mass flow controllers providing N2 and N2/H2 process gases PC control which allows full process monitoring and data acquisition
Specifications	Temperature range: ambient to 1000C Thermocouple control: ambient to 1000C Maximum heat rate: 200C/second