FLIP1: Flip Chip Bonder

Model: Karl Suss FC150
Location: 1505 Fitzpatrick CIEMAS
Tool Group and Rate: Clean Room - $36.1/$72.2 per hour

Training Request Training for FLIP1 Helpful Links Suss MicroTec Website

The Suss FC150 Flip Chip Bonder is a precision instrument used to align and bond one or more chips on a substrate using either solder reflow or thermo-compression techniques.  The FC150 can acheive 1um placement accuracy.

Applications	Flip chip bonding of chips to substrates using: Solder reflow Thermo-compression
Features	Pre-programmed instructions for site location and bonding parameters User software control for alignment
Specifications	Chip size: 0.2-40mm Substrate size: 0.5-150mm Stage movement: X travel: 300mm Y travel: 250mm Resolution: 1um Universal bonding arm (UBA) Placement accuracy: 1um Force range: 0-50kg Chip Heating chuck: Room temp to 450C Substrate Heating Chuck: Room temp to 450C