SMIF consists of an Instrumentation Laboratory for the characterization and analysis of materials, and a Fabrication Laboratory for the fabrication of devices and micro/nano-structures.

CODE	EQUIPMENT	MODEL	APPLICATIONS
SEM2 ()
CLEANROOM (1505 Fitzpatrick CIEMAS)
ACIDHOOD1	Small Acid Chemical Hood	Air Control Acid Hood	For acid chemical processing
ACIDHOOD2	Large ADA Acid Chemical Hood	Air Control Acid Hood	For acid chemical processing
ASH1	Plasma Asher	Emitech K-1050X	O2 / Ar plasma ashing of photoresist and other organic materials
BIOHOOD1	Biological Hood
BIOHOOD2	Biological Hood
COATHOOD1 -A-	Spin Coat Hood (left spinner) - RESIST ONLY	Air Control Spin Coat Hood	For spin coating photoresist and EBL resists ONLY
COATHOOD1 -B-	Spin Coat Hood (right spinner) - RESIST ONLY	Air Control Spin Coat Hood	For spin coating photoresist and EBL resists ONLY
COATHOOD2 -A-	Spin Coat Hood (left spinner) - ANY MATERIAL	Air Control Spin Coat Hood	For spin coating materials
COATHOOD2 -B-	Spin Coat Hood (right spinner) - ANY MATERIAL	Air Control Spin Coat Hood	For spin coating materials
DEVHOOD1 -A-	Develop Hood (left side)	Air Control Develop Hood	For photoresist  base develop processing
DEVHOOD1 -B-	Develop Hood (right side)	Air Control Develop Hood	For photoresist  base develop processing
EBL1	E-Beam Lithography System	Elionix ELS-7500 EX E-Beam Lithography System	Electron Beam Lithography and SEM imaging
ELL1	Ellipsometer	Rudolph Auto EL III	Thickness and index of refraction measurements of thin oxide, nitride, and organic films and optical constants of substrates.
EVAP1	E-Beam Metal Evaporator	CHA Industries Solution E-Beam	Deposition of thin metal films
EVAP2	E-beam & Thermal Metal Evaporator	Kurt Lesker PVD 75	E-beam and thermal evaporation of metal films
FLIP1	Flip Chip Bonder	Karl Suss FC150	Flip-chip bonding applications
FURN3	Furnace - Hydrogen anneal	ATS Series 3210	Annealing in Hydrogen, Nitrogen, or vacuum environments
GLOVE1	Glove Box	MBraun Labmaster 130	Performing processes in an inert environment
HOT1	Digital Hot Plate	Tek-Vac PRC-2000	Controlled baking and curing of photoresist materials
NANO1	Film Thickness Measurement	Nanometrics 210	Film thickness measurements up to 50mm
OVEN2	Bake Oven	Thermo Scientific Lindberg/Blue M General-Purpose Oven	Annealing, baking and curing up to 260C in air
OVEN3	Vacuum Bake Oven	YES - 450PBA	Vacuum and nitrogen baking and curing.
PECVD1	Plasma Enhanced Chemical Vapor Deposition System	Advanced Vacuum Vision 310	PECVD deposition of Oxide, Nitride, and Oxynitride films
PHOTO1	Mask Aligner	Suss MicroTec MJB3	Photolithographic patterning
PHOTO2	Frontside/Backside Mask Aligner	Karl Suss MA6/BA6	For Topside or Backside photo alignment and exposure.
PROBE1	Probe Station	Signatone S-1160A-5	The probe station consists of a manual probe system with 4 indepedent probe micromanipulators and a mercury probe system. Both probe systems can be configured with a parametric analyzer and  LCR meter for measuring current, voltage, resistance, capacitance, and conductance of devices and structures. This system also includes a 4 point resistivity probing system for making sheet-resistance and resistivity measurements of substrates and films.
PROF2	Profilometer	Veeco Dektak 150	Surface profiling and step height measurements
RIE1	Oxide/Nitride/Polymer Reactive Ion Etcher	Trion Technology Phantom II	Reactive Ion Etching (RIE) of oxide, nitride, and polymer films with fluorine and oxygen chemistries
RIE2	III-V Reactive Ion Etcher	Trion Technology Minilock II	Reactive Ion Etching (RIE) of compound III-V semiconductors using chlorine and bromine based chemistries
RTA1	Rapid Thermal Anneal System	Jipelec JetFirst 100	Rapid thermal annealing up to 1000C in air, vacuum, N2, or forming gas (N2/H2)
SCOPE1	Microscope w/ camera (manual)	Nikon Eclipse ME600	Optical Microscopy
SCOPE3	Fluorescence Microscope w/camera	Zeiss AxioImager	Fluorescence and Optical Microscopy
SCOPE4	Nomarski Microsope w/camera	Zeiss AxioImager	BF, DF, and Nomarski optical microscopy
SOLVHOOD1	Small Solvent Chemical Hood	Air Control Solvent Hood	For solvent chemical processing
SOLVHOOD2	Large ADA Solvent Chemical Hood	Air Control Solvent Hood	For solvent chemical processing (including ultrasonics)
SPUT2	RF Dielectric Sputter System	Kurt Lesker PVD 75	RF sputter coating of dielectric materials
SPUT3	DC Sputter System	Kurt Lesker PVD 75	DC sputter coating of metals
X-RAY LAB (1537 Fitzpatrick CIEMAS)
XDIF1	X-Ray Diffractometer	Philips X’Pert PRO MRD HR X-Ray Diffraction System	The X-Ray diffraction system can be used for characterizing structural properties of a wide range of materials
XPS1	X-Ray Photoelectron Spectrometer	Kratos Analytical Axis Ultra	XPS is a technique for the detection of variations in chemical composition and oxidation state. The AXIS Ultra provides a high energy resolution capability for both conductive and insulating samples.
OPTICAL CHARACTERIZATION LAB (1541 Fitzpatrick CIEMAS)
OPT2	FT-IR Spectrometer	Thermo Electron Nicolet 8700	Optical characterization of samples over Infra-Red wavelengths
OPT3	RAMAN/PL	Horiba Jobin Yvon LabRam ARAMIS	Raman and PL spectroscopy
AFM / ZYGO / MSA LAB (1545 Fitzpatrick CIEMAS)
AFM1	Scanning Probe Microscope	Digital Instruments Dimension 3100	The Scanning Probe Microscope (SPM) utilizes automated atomic force microscopy (AFM) and scanning tunneling microscopy (STM) techniques to measure various surface characteristics.
MSA1	Micro-Strain Analyzer	TA Instruments RSA III	Mechanical analysis (stess/strain, etc) of materials samples such as polymer films, fibers, and elastomers
OPT1	UV-Vis-NIR Spectrophotometer	Shimadzu UV-3600	Optical characterization of samples over UV-Vis-NIR wavelengths
SCOPE2	Stereo Microscope	Leica Stereozoom 6	Stereo Microscope
ZYGO1	3D Optical Profiler	Zygo NewView 5000	The 3-D Optical Profiler uses interferometry for imaging and quantifying topographical features such as step heights, critical dimensions, curvature, and roughness.
TEM LAB (1549 Fitzpatrick CIEMAS)
TEM2	Transmission Electron Microscope	FEI Tecnai G² Twin	The TEM is a high magnification imaging tool. Resolution is on the order of 0.3nm.
SEM LAB (1557 and 1567 Fitzpatrick CIEMAS)
SEM1	Scanning Electron Microscope	FEI XL30 SEM-FEG	The SEM is a high magnification imaging tool. Resolution is on the order of 2nm.
SEM2	Environmental Scanning Electron Microscope	FEI XL30 ESEM	The ESEM is another high magnification imaging tool that can be used to examine dry or hydrated samples.
SAMPLE PREP & OFFLINE LAB (1562 Fitzpatrick CIEMAS)
ACIDHOOD3	Prep/Offline Acid Chemical Hood	Air Control Acid Hood	For acid chemical processing in a non-cleanroom environment
CPD1	Critical Point Dryer	Bal-Tec CPD 030	Critical point CO2 drying
OVEN1	High Temperature Bake Oven	Keison Carbolite LHT 6/30	Annealing, baking and curing up to 600C in an N2 ambient
OVEN4	Low Temperature Oven for Non-Hazardous Materials	VWR 1350U	Low temperature baking of non-hazardous materials up to 100C
PARYL1	Parylene Coater	Cookson Electronics PDS 2010 LABCOTER2	Accurate deposition of parylene films
PLAP1	Polishing and Lapping Machine	Logitech PM5	Polishing and Lapping
SAW1	Precision Sectioning Machine (Dicing Saw)	Allied High Tech TechCut 5	Saw cutting a wide variety and size of materials.   Can perform wafer/substrate dicing as well as sectioning.
SCOPE5	Microscope	Mitutoyo Ultaplan FS110	BF microscopy with long working distance objectives
SCOPE6	Microscope w/camera	American Scope ME500T	BF and DF optical microscopy in reflection or transmitted light mode
SCOPE7	Stereo Microscope	American Scope SM-4TZ-FRL	Stereo Microscope
SOLVHOOD3	Prep/Offline Solvent Chemical Hood	Air Control Solvent Hood	For solvent chemical processing in a non-cleanroom environment
SPUT1	Vacuum Coating System	Bal-Tec MED 020	Sputter coating or e-beam evaporation for a variety of sample preparation processes
SPUT4	Vacuum Sputter Coater	Denton Desk IV	Au sputtering for SEM samples
VITRO1	Vitrobot	Mark III	Vitrifies suspension samples for imaging with the cryo-TEM.
WIBO1	Wire Bonder	West Bond 747677E	Wire bonding to interconnect wire leads to semiconductor, hybrid, or microwave devices.