| CODE |
EQUIPMENT |
MODEL |
APPLICATIONS |
| ACIDHOOD1 |
Small Acid Chemical Hood |
Air Control Acid Hood |
For acid chemical processing |
| ACIDHOOD2 |
Large ADA Acid Chemical Hood |
Air Control Acid Hood |
For acid chemical processing |
| ASH1 |
Plasma Asher |
Emitech K-1050X |
O2 / Ar plasma ashing of photoresist and other organic materials |
| BIOHOOD1 |
Biological Hood |
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| BIOHOOD2 |
Biological Hood |
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| COATHOOD1 -A- |
Spin Coat Hood (left spinner) - RESIST ONLY |
Air Control Spin Coat Hood |
For spin coating photoresist and EBL resists ONLY |
| COATHOOD1 -B- |
Spin Coat Hood (right spinner) - RESIST ONLY |
Air Control Spin Coat Hood |
For spin coating photoresist and EBL resists ONLY |
| COATHOOD2 -A- |
Spin Coat Hood (left spinner) - ANY MATERIAL |
Air Control Spin Coat Hood |
For spin coating materials |
| COATHOOD2 -B- |
Spin Coat Hood (right spinner) - ANY MATERIAL |
Air Control Spin Coat Hood |
For spin coating materials |
| DEVHOOD1 -A- |
Develop Hood (left side) |
Air Control Develop Hood |
For photoresist base develop processing |
| DEVHOOD1 -B- |
Develop Hood (right side) |
Air Control Develop Hood |
For photoresist base develop processing |
| EBL1 |
E-Beam Lithography System |
Elionix ELS-7500 EX E-Beam Lithography System |
Electron Beam Lithography and SEM imaging |
| ELL1 |
Ellipsometer |
Rudolph Auto EL III |
Thickness and index of refraction measurements of thin oxide, nitride, and organic films and optical constants of substrates. |
| EVAP1 |
E-Beam Metal Evaporator |
CHA Industries Solution E-Beam |
Deposition of thin metal films |
| EVAP2 |
E-beam & Thermal Metal Evaporator |
Kurt Lesker PVD 75 |
E-beam and thermal evaporation of metal films |
| FLIP1 |
Flip Chip Bonder |
Karl Suss FC150 |
Flip-chip bonding applications |
| FURN2-Tube1 |
High Temperature Anneal N-type doping |
Tempress 6304 4-Stack Furnace |
High Temperature Annealing (750C-1050C) in Nitrogen used for N-type doped substrates |
| FURN2-Tube2 |
Dry Oxidation |
Tempress 6304 4-Stack Furnace |
Dry oxidation (950C-1050C) in Oxygen |
| FURN2-Tube3 |
Low Temp Anneal and High Temp Anneal for P-type doping |
Tempress 6304 4-Stack Furnace |
Low Temperature Annealing (400C-600C) in Nitrogen or Forming Gas and High Temp Annealing (up to 1050C) in Nitrogen of P-type substrates |
| FURN3 |
Furnace - Hydrogen anneal |
ATS Series 3210 |
Annealing in Hydrogen, Nitrogen, or vacuum environments |
| GLOVE1 |
Glove Box |
MBraun Labmaster 130 |
Performing processes in an inert environment |
| HOT1 |
Digital Hot Plate |
Tek-Vac PRC-2000 |
Controlled baking and curing of photoresist materials |
| NANO1 |
Film Thickness Measurement |
Nanometrics 210 |
Film thickness measurements up to 50mm |
| OVEN2 |
Bake Oven |
Thermo Scientific Lindberg/Blue M General-Purpose Oven |
Annealing, baking and curing up to 260C in air |
| OVEN3 |
Vacuum Bake Oven |
YES - 450PBA |
Vacuum and nitrogen baking and curing. |
| PECVD1 |
Plasma Enhanced Chemical Vapor Deposition System |
Advanced Vacuum Vision 310 |
PECVD deposition of Oxide, Nitride, and Oxynitride films |
| PHOTO1 |
Mask Aligner |
Suss MicroTec MJB3 |
Photolithographic patterning |
| PHOTO2 |
Frontside/Backside Mask Aligner |
Karl Suss MA6/BA6 |
For Topside or Backside photo alignment and exposure. |
| PROBE1 |
Probe Station |
Signatone S-1160A-5 |
The probe station consists of a manual probe system with 4 indepedent probe micromanipulators. It is configured with a parametric analyzer and a LCR meter for measuring current, voltage, resistance, capacitance, and conductance of devices and structures.
This system also includes a 4 point resistivity probing system for making sheet-resistance and resistivity measurements of substrates and films. |
| PROF2 |
Profilometer |
Veeco Dektak 150 |
Surface profiling and step height measurements |
| RIE1 |
Oxide/Nitride/Polymer Reactive Ion Etcher |
Trion Technology Phantom II |
Reactive Ion Etching (RIE) of oxide, nitride, and polymer films with fluorine and oxygen chemistries |
| RIE2 |
III-V Reactive Ion Etcher |
Trion Technology Minilock II |
Reactive Ion Etching (RIE) of compound III-V semiconductors using chlorine and bromine based chemistries |
| RTA1 |
Rapid Thermal Anneal System |
Jipelec JetFirst 100 |
Rapid thermal annealing up to 1000C in air, vacuum, N2, or forming gas (N2/H2) |
| SCOPE1 |
Microscope w/ camera (manual) |
Nikon Eclipse ME600 |
Optical Microscopy |
| SCOPE3 |
Fluorescence Microscope w/camera |
Zeiss AxioImager |
Fluorescence and Optical Microscopy |
| SCOPE4 |
Nomarski Microsope w/camera |
Zeiss AxioImager |
BF, DF, and Nomarski optical microscopy |
| SOLVHOOD1 |
Small Solvent Chemical Hood |
Air Control Solvent Hood |
For solvent chemical processing |
| SOLVHOOD2 |
Large ADA Solvent Chemical Hood |
Air Control Solvent Hood |
For solvent chemical processing (including ultrasonics) |
| SPUT2 |
RF Dielectric Sputter System |
Kurt Lesker PVD 75 |
RF sputter coating of dielectric materials |
| SPUT3 |
DC Sputter System |
Kurt Lesker PVD 75 |
DC sputter coating of metals |