SMIF
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Capabilities

Cleanroom

Location: 1505 Fitzpatrick CIEMAS

CODE
EQUIPMENT
MODEL
APPLICATIONS
ACIDHOOD1
Small Acid Chemical Hood Air Control Acid Hood For acid chemical processing
ACIDHOOD2
Large ADA Acid Chemical Hood Air Control Acid Hood For acid chemical processing
ASH1
Plasma Asher Emitech K-1050X O2 / Ar plasma ashing of photoresist and other organic materials
BIOHOOD1
Biological Hood
BIOHOOD2
Biological Hood
COATHOOD1 -A-
Spin Coat Hood (left spinner) - RESIST ONLY Air Control Spin Coat Hood For spin coating photoresist and EBL resists ONLY
COATHOOD1 -B-
Spin Coat Hood (right spinner) - RESIST ONLY Air Control Spin Coat Hood For spin coating photoresist and EBL resists ONLY
COATHOOD2 -A-
Spin Coat Hood (left spinner) - ANY MATERIAL Air Control Spin Coat Hood For spin coating materials
COATHOOD2 -B-
Spin Coat Hood (right spinner) - ANY MATERIAL Air Control Spin Coat Hood For spin coating materials
DEVHOOD1 -A-
Develop Hood (left side) Air Control Develop Hood For photoresist  base develop processing
DEVHOOD1 -B-
Develop Hood (right side) Air Control Develop Hood For photoresist  base develop processing
EBL1
E-Beam Lithography System Elionix ELS-7500 EX E-Beam Lithography System Electron Beam Lithography and SEM imaging
ELL1
Ellipsometer Rudolph Auto EL III Thickness and index of refraction measurements of thin oxide, nitride, and organic films and optical constants of substrates.
EVAP1
E-Beam Metal Evaporator CHA Industries Solution E-Beam Deposition of thin metal films
EVAP2
E-beam & Thermal Metal Evaporator Kurt Lesker PVD 75 E-beam and thermal evaporation of metal films
FLIP1
Flip Chip Bonder Karl Suss FC150 Flip-chip bonding applications
FURN2-Tube1
High Temperature Anneal N-type doping Tempress 6304 4-Stack Furnace

High Temperature Annealing (750C-1050C) in Nitrogen used for N-type doped substrates

FURN2-Tube2
Dry Oxidation Tempress 6304 4-Stack Furnace Dry oxidation  (950C-1050C) in Oxygen
FURN2-Tube3
Low Temp Anneal and High Temp Anneal for P-type doping Tempress 6304 4-Stack Furnace Low Temperature Annealing (400C-600C) in Nitrogen or Forming Gas and High Temp Annealing (up to 1050C) in Nitrogen of P-type substrates
FURN3
Furnace - Hydrogen anneal ATS Series 3210 Annealing in Hydrogen, Nitrogen, or vacuum environments
GLOVE1
Glove Box MBraun Labmaster 130 Performing processes in an inert environment
HOT1
Digital Hot Plate Tek-Vac PRC-2000 Controlled baking and curing of photoresist materials
NANO1
Film Thickness Measurement Nanometrics 210 Film thickness measurements up to 50mm
OVEN2
Bake Oven Thermo Scientific Lindberg/Blue M General-Purpose Oven Annealing, baking and curing up to 260C in air
OVEN3
Vacuum Bake Oven YES - 450PBA Vacuum and nitrogen baking and curing.
PECVD1
Plasma Enhanced Chemical Vapor Deposition System Advanced Vacuum Vision 310 PECVD deposition of Oxide, Nitride, and Oxynitride films
PHOTO1
Mask Aligner Suss MicroTec MJB3 Photolithographic patterning
PHOTO2
Frontside/Backside Mask Aligner Karl Suss MA6/BA6 For Topside or Backside photo alignment and exposure.
PROBE1
Probe Station Signatone S-1160A-5

The probe station consists of a manual probe system with 4 indepedent probe micromanipulators. It is configured with a parametric analyzer and a LCR meter for measuring current, voltage, resistance, capacitance, and conductance of devices and structures.

This system also includes a 4 point resistivity probing system for making sheet-resistance and resistivity measurements of substrates and films.

PROF2
Profilometer Veeco Dektak 150 Surface profiling and step height measurements
RIE1
Oxide/Nitride/Polymer Reactive Ion Etcher Trion Technology Phantom II Reactive Ion Etching (RIE) of oxide, nitride, and polymer films with fluorine and oxygen chemistries
RIE2
III-V Reactive Ion Etcher Trion Technology Minilock II

Reactive Ion Etching (RIE) of compound III-V semiconductors using chlorine and bromine based chemistries

RTA1
Rapid Thermal Anneal System Jipelec JetFirst 100 Rapid thermal annealing up to 1000C in air, vacuum, N2, or forming gas (N2/H2)
SCOPE1
Microscope w/ camera (manual) Nikon Eclipse ME600

Optical Microscopy

SCOPE3
Fluorescence Microscope w/camera Zeiss AxioImager Fluorescence and Optical Microscopy
SCOPE4
Nomarski Microsope w/camera Zeiss AxioImager

BF, DF, and Nomarski optical microscopy

SOLVHOOD1
Small Solvent Chemical Hood Air Control Solvent Hood For solvent chemical processing
SOLVHOOD2
Large ADA Solvent Chemical Hood Air Control Solvent Hood For solvent chemical processing (including ultrasonics)
SPUT2
RF Dielectric Sputter System Kurt Lesker PVD 75 RF sputter coating of dielectric materials
SPUT3
DC Sputter System Kurt Lesker PVD 75 DC sputter coating of metals

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